Published March 2010 | Version v1
Journal article

One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

  • 1. DTU Nanotech, Department of Micro- and Nanotechnology, Technical University of Denmark (DTU), Ørsteds Plads, Bygning 345Ø, DK-2800, Kongens Lyngby (Denmark)

Description

A simple method for creating interconnections to a common microfluidic device material, poly(methyl methacrylate) (PMMA), is presented. A press-fit interconnection is created between oversized, deformable tubing and complementary, undersized semi-circular ports fabricated into PMMA bonding surfaces by direct micromilling. Upon UV-assisted bonding the tubing is trapped in the ports of the PMMA chip and forms an integrated, in-plane and adhesive-free interconnection. The interconnections support the average pressure of 6.1 bar and can be made with small dead volumes. A comparison is made to a similar interconnection approach which uses tubing to act as a gasket between a needle and port on the microfluidic chip. (technical note)

Availability note (English)

Available from http://dx.doi.org/10.1088/0960-1317/20/3/037001

Additional details

Identifiers

DOI
10.1088/0960-1317/20/3/037001;
PII
S0960-1317(10)29898-6;

Publishing Information

Journal Title
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Journal Volume
20
Journal Issue
3
Journal Page Range
[7 p.]
ISSN
0960-1317
CODEN
JMMIEZ

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
46021812
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
ADHESIVES; BONDING; FLUIDS; PMMA; PRESSES; SURFACES; TRAPPING
Descriptors DEC
ESTERS; FABRICATION; JOINING; ORGANIC COMPOUNDS; ORGANIC POLYMERS; POLYACRYLATES; POLYMERS; POLYVINYLS