Forming parts over small radii
Creators
- 1. WMG, University of Warwick, Coventry CV4 7AL (United Kingdom)
- 2. School of Engineering, Deakin University (Australia)
Description
Stamping simulations usually make the plane stress simplifying assumption. However, this becomes less valid when material draws around features with radius to sheet thickness ratios less than 20. Pereira, Yan and Rolfe (Wear, Vol.265, p.1687 (2008)) predicted that out-of-plane stress equivalent to material yield can occur because a line contact forms briefly at the start of the draw process. The high transient stress can cause high rates of tool wear and may cause the 'die impact line' cosmetic defect. In this work, we present residual strain results of a channel section that was drawn over a small radius. Using the neutron source at the Institut Laue-Langevin, in-plane and out-of-plane strains were measured in the channel part to show some support for the conclusions of Pereira et. al. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/1742-6596/734/3/032096Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Physics. Conference Series (Online)
- Journal Volume
- 734
- Journal Issue
- 3
- Journal Page Range
- [4 p.]
- ISSN
- 1742-6596
Conference
- Title
- 10. international conference and workshop on numerical simulation of 3D sheet metal forming processes
- Acronym
- NUMISHEET 2016
- Dates
- 4-9 Sep 2016
- Place
- Bristol (United Kingdom)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 48100222
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- COMPUTERIZED SIMULATION; NEUTRON DIFFRACTION; NEUTRON SOURCES; RESIDUAL STRESSES; SHEETS; STRAINS; THICKNESS; TRANSIENTS; WEAR; YIELDS
- Descriptors DEC
- COHERENT SCATTERING; DIFFRACTION; DIMENSIONS; PARTICLE SOURCES; RADIATION SOURCES; SCATTERING; SIMULATION; STRESSES