Electrodeposition of Bi2Te3-based p and n-type ternary thermoelectric compounds in chloride baths
- 1. Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan (China)
- 2. Material and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 310, Taiwan (China)
Description
Highlights: •Bi2Te3-based ternary thermoelectric compounds were electroplated in chloride baths. •Around 30-μm-thick n-type film is compact, but compact p-type film is •Compact p-type film is electroplated using pulsed electrodeposition. •Roughness deteriorates thermoelectric properties of Bi2Te3-based ternary compounds. -- Abstract: The electrocrystallization of p-type Bi-Sb-Te and n-type Bi-Te-Se thermoelectric (TE) compounds in chloride baths was detailed in this study. Based on the cyclic voltammetry (CV) results, target p-type films can be electroplated using pulsed electrodeposition and the n-type films can be electroplated via potentiostatic electrodeposition. The n-type film shows a compact structure throughout the course of electrodeposition. The resulting 27-μm-thick Bi1.88Te2.70Se0.42 film has a Seebeck coefficient of −50 μV/K and a power factor of 130 μW/m·K2 at room temperature. Conversely, nodular and dendritic p-type grains develop on top of a compact under layer as the electrodeposition proceeds. This development is accompanied by the disappearance of the nucleation loop in CV. Moreover, the presence of a distinct Te-rich layer was observed at the p-type film/substrate interface. The loose structure associated with nodular and dendritic p-type grains results in increased resistance and decreased power factor, but slightly influences the Seebeck coefficient. The p-type Bi0.45Sb1.22Te3.33 film with optimal thermoelectric properties is obtained via pulsed deposition with a thickness of around 2 μm and has a Seebeck coefficient of +150 μV/K and a power factor of 150 μW/m·K2 at room temperature. Finally, the electric resistance and uncompensated ohmic drop need to be considered for the electrodeposition of a compact p-type Bi-Sb-Te film with optimal TE properties.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.tsf.2018.06.001Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2018.06.001;
- PII
- S004060901830395X;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 660
- Journal Page Range
- p. 108-119
- ISSN
- 0040-6090
- CODEN
- THSFAP
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 50037022
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ANTIMONY ADDITIONS; BISMUTH TELLURIDES; CHLORIDES; ELECTRODEPOSITION; INTERFACES; LAYERS; N-TYPE CONDUCTORS; POWER FACTOR; P-TYPE CONDUCTORS; ROUGHNESS; SELENIDES; SUBSTRATES; THERMOELECTRIC PROPERTIES; THICKNESS; THIN FILMS; VOLTAMETRY
- Descriptors DEC
- ALLOYS; ANTIMONY ALLOYS; BISMUTH COMPOUNDS; CHALCOGENIDES; CHLORINE COMPOUNDS; DEPOSITION; DIMENSIONLESS NUMBERS; DIMENSIONS; ELECTRICAL PROPERTIES; ELECTROLYSIS; FILMS; HALIDES; HALOGEN COMPOUNDS; LYSIS; MATERIALS; PHYSICAL PROPERTIES; SELENIUM COMPOUNDS; SEMICONDUCTOR MATERIALS; SURFACE COATING; SURFACE PROPERTIES; TELLURIDES; TELLURIUM COMPOUNDS
Optional Information
- Copyright
- Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.