Published February 15, 2013 | Version v1
Journal article

Low cycle fatigue and creep-fatigue behavior of Ni-based alloy 230 at 850 °C

  • 1. Oak Ridge National Laboratory, 1 Bethel Valley Road, Oak Ridge, TN 37831 (United States)
  • 2. Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana-Champaign, 104 South Wright Street, Urbana, IL 61801 (United States)
  • 3. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China)

Description

Strain-controlled low cycle fatigue (LCF) and creep-fatigue testing of Ni-based alloy 230 were carried out at 850 °C. The material creep-fatigue life decreased compared with its low cycle fatigue life at the same total strain range. Longer hold time at peak tensile strain further reduced the material creep-fatigue life. Based on the electron backscatter diffraction, a novel material deformation characterization method was applied, which revealed that in low cycle fatigue testing as the total strain range increased, the deformation was segregated to grain boundaries since the test temperature was higher than the material equicohesive temperature and grain boundaries became weaker regions compared with grains. Creep-fatigue tests enhanced the localized deformation, resulting in material interior intergranular cracking, and accelerated material damage. Precipitation in alloy 230 helped slip dispersion, favorable for fatigue property, but grain boundary cellular precipitates formed after material exposure to the elevated temperature had a deleterious effect on the material low cycle fatigue and creep-fatigue property

Availability note (English)

Available from http://dx.doi.org/10.1016/j.msea.2012.11.063

Additional details

Identifiers

DOI
10.1016/j.msea.2012.11.063;
PII
S0921-5093(12)01615-2;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
563
Journal Page Range
p. 152-162
ISSN
0921-5093
CODEN
MSAPE3

Optional Information

Copyright
Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.