Published October 30, 2012 | Version v1
Journal article

Wear and corrosion behaviors of Ti6Al4V alloy biomedical materials by silver plasma immersion ion implantation process

  • 1. School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093 (China)
  • 2. Faculty of Adult Education, Kunming University of Science and Technology, Kunming 650051 (China)
  • 3. State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001 (China)

Description

In order to improve the wear resistance and anti-corrosion behaviors of Ti6Al4V (TC4) alloy, polished samples were implanted with silver (Ag) ions by plasma immersion ion implantation (PIII) technique. The phase composition and element concentration–depth distribution in modified layer were characterized by X-ray diffraction (XRD) and Auger electron spectrum (AES). Corrosion resistance, microhardness, friction and wear behaviors of PIII-TC4 alloy changed with the Ag ion implantation dose. XRD analysis reveals that the surface modified layer consists of Ag and a small amount of TiAg phases. AES results show that Ag atomic peak concentration is 9.88%, about 14.4 nm from the surface. The maximum nanohardness and elastic modulus of PIII-TC4 alloy increases by 62.5% and 54.5%, respectively. The lowest friction coefficient reduces from 0.78 to 0.2. The test result of potentiodynamic polarization in 3.5% NaCl saturated solution indicates that the sample of Ag ion dose at 1.0 × 1017 ions/cm2 has the best corrosion resistance with the lowest corrosion current density and the least porosity.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2012.02.046

Additional details

Identifiers

DOI
10.1016/j.tsf.2012.02.046;
PII
S0040-6090(12)00178-2;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
521
Journal Page Range
p. 89-93
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
3. international conference on microelectronics and plasma technology
Acronym
ICMAP2011
Dates
4-7 Jul 2011
Place
Dalian (China)

Optional Information

Copyright
Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.