Published August 13, 2024 | Version v1
Journal article

Phonon resonance effect and defect scattering in covalently bonded carbon nanotube networks

  • 1. Guangzhou Key Laboratory of Low-Dimensional Materials and Energy Storage Devices, School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China
  • 2. School of Physics and Materials Science, Guangzhou University, Guangzhou 510006, China

Description

Covalently bonded carbon nanotube (CNT) networks offer promising potential for heat-dissipation applications due to their low interfacial thermal resistivity between connected CNTs. In this work, the thermal-transport properties of covalently bonded CNT networks were simulated by molecular dynamics. It was found that the thermal conductivity (TC) of the networked CNTs is periodic dependent. Although the TCs are reduced compared to those of pristine CNTs, they are considerably larger than the values in thermal interface materials. The TC reduction with respect to the pristine CNTs primarily stems from defect scattering at junctions and resonant scattering generated by CNTs oriented perpendicular to the transport direction. The two mechanisms operate over different frequency ranges and collectively contribute to a reduction in both phonon group velocity and relaxation time across the entire frequency range. Moreover, we demonstrate that increasing the network period in a specific direction increases the TC along this direction, while reduces TC in the perpendicular direction due to intensified resonant coupling. Such directional-dependent TC variations with period facilitate the regulation of thermal-transport anisotropy within CNT networks. Overall, our findings elucidate the underlying phonon transport mechanisms in CNT networks and offer valuable insights into the design of thermal interface materials, thermal insulation materials, and materials with tailored thermal anisotropy. By leveraging the identified mechanisms, it becomes possible to develop CNT-based materials with enhanced heat-dissipation capabilities and engineered TC profiles.

Additional details

Identifiers

DOI
10.1103/PhysRevApplied.22.024038;
Crossref Funder ID
10.13039/501100001809;

Publishing Information

Journal Title
Physical Review Applied
Journal Volume
22
Journal Issue
2
Journal Page Range
9 pgs.
ISSN
2331-7019

Optional Information

Copyright
© 2024 American Physical Society
Contract/Grant/Project number
12174276; 12304059; 2024A1515010521; 2022A1515110572
Notes
Contact Email: Contact author: syxiong@gdut.edu.cn, xiongshiyun216@163.com; Record automatically processed
Funding organization
National Natural Science Foundation of China; Basic and Applied Basic Research Foundation of Guangdong Province