High-resolution electron beam lithography for the fabrication of high-density dielectric metamaterials
- 1. School of Electronics and Computer Science, University of Southampton, SO17 1BJ (United Kingdom)
- 2. Innos Ltd, Gower Building, Highfield, Southampton (United Kingdom)
Description
Electron beam lithography has been applied to the fabrication of nanoscale two-dimensional chiral structures with various designs. A fabrication process for planar chiral structures in a thin silicon nitride layer using electron beam lithography and dry etching is presented. A top conductive coating is applied during electron-beam exposure to prevent the occurrence of charging effects caused by the non-conductive silica substrate. Different doses are chosen during the lithography process depending on the complexities and densities of different chiral designs. A very well defined transmission diffraction pattern from arrays of Peano-Gosper fractals is obtained. The optical activity of these dielectric metamaterials shows great potential in their applications of optoelectronic devices and communications
Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2006.09.011;
- PII
- S0040-6090(06)01060-1;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 515
- Journal Issue
- 7-8
- Journal Page Range
- p. 3714-3717
- ISSN
- 0040-6090
- CODEN
- THSFAP
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39021134
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CHIRALITY; DIELECTRIC MATERIALS; DIFFRACTION; ELECTRON BEAMS; ETCHING; FABRICATION; LAYERS; NANOSTRUCTURES; OPTICAL ACTIVITY; PROXIMITY EFFECT; RADIATION DOSES; SILICON NITRIDES
- Descriptors DEC
- BEAMS; COHERENT SCATTERING; DOSES; LEPTON BEAMS; MATERIALS; NITRIDES; NITROGEN COMPOUNDS; OPTICAL PROPERTIES; PARTICLE BEAMS; PARTICLE PROPERTIES; PHYSICAL PROPERTIES; PNICTIDES; SCATTERING; SILICON COMPOUNDS; SURFACE FINISHING
Optional Information
- Copyright
- Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.