Fabrication and Evaluation Properties of Titanium Sintered-body for a Sputtering Target by Spark Plasma Sintering Process

The Spark Plasma Sintering(SPS) method offers a means of fabricating a sintered-body having high density without grain growth through short sintering time and a one-step process. A titanium compact having high density and purity was fabricated by the SPS process. It can be used to fabricate a Ti sputtering target with controlled parameters such as sintering temperature, heating rate, and pressure to establish the optimized processingconditions. The compact/target(?) has a diameter of Φ15 ×6.35 mm. The density, purity, phase transformation, and microstructure of the Ti compact were analyzed by Archimedes, ICP, XRD and FESEM. A Ti thin-film fabricated on a Si/SiO₂ substrate by a sputtering device (SRN-100) was analyzed by XRD, TEM, and SIMS. Density and grain size were up to 99% and below 40 µm, respectively. The specific resistivity of the optimized Ti target was 8.63×10^-6 Ω· cm.