Versatile high intensity negative ion source

The negative ions source in which these ions are generated at sputtering a solid surface by positive ions of cesium is decribed. Cesium ionizer and sputtered target of the material of which negative ions are produced, are placed in a common chamber filled by cesium vapours. This quarantees a sufficient exposure of a sputtered surface in neutral cesium and allows one to control cesium deposition rate by regulating its flow. Cesium ions are produced due to surface ionization and then they are accelerated and electrostatically focused onto the sputtered cathode. Characteristics of two types of sources and values of negative ion currents for various targets are given