Published September 2014 | Version v1
Miscellaneous

Full 3D internal strain measurement for device packaging materials using synchrotron laminography and volumetric digital image correlation method

  • 1. Toyota Central R and D Labs., Inc., Nagakute, Aichi (Japan)
  • 2. Japan Synchrotron Radiation Research Institute (JASRI), Sayo, Hyogo (Japan)

Description

In order to measure full 3D internal strain field of resin molding compound specimens, synchrotron computed tomography and laminography at SPring-8 were performed. Then the reconstructed images were applied to 3D digital image correlation method to compute internal strain field. The results showed that internal strains in resin molding compound could be visualized in this way. (author)

Part of:
Proceedings of the mechanical engineering congress 2014 Tokyo

Additional details

Publishing Information

Imprint Title
Proceedings of the mechanical engineering congress 2014 Tokyo
Imprint Pagination
[5216 p.]
Journal Page Range
[4 p.]

Conference

Title
Mechanical engineering congress
Acronym
MECJ-14
Dates
7-10 Sep 2014
Place
Tokyo (Japan)

Optional Information

Notes
Available as DVD-ROM Data in PDF format, Folder Name: pdf; Paper ID: J0310204.pdf; 4 refs., 6 figs., 1 tab.