Published April 2008
| Version v1
Journal article
SILC during NBTI Stress in PMOSFETs with Ultra-Thin SiON Gate Dielectrics
- 1. School of Microelectronics, Xidian University, Xi'an 710071 Key Lab of Wide Band-Gap Semiconductor Materials and Devices, Xidian University, Xi'an 710071 (China)
Description
Negative bias temperature instability (NBTI) and stress-induced leakage current (SILC) both are more serious due to the aggressive scaling lowering of devices. We investigate the SILC during NBTI stress in PMOSFETs with ultra-thin gate dielectrics. The SILC sensed range from -1 V to 1 V is divided into four parts: the on-state SILC, the near-zero SILC, the off-state SILC sensed at lower positive voltages and the one sensed at higher positive voltages. We develop a model of tunnelling assisted by interface states and oxide bulk traps to explain the four different parts of SILC during NBTI stress
Availability note (English)
Available from http://dx.doi.org/10.1088/0256-307X/25/4/071Additional details
Identifiers
Publishing Information
- Journal Title
- Chinese Physics Letters
- Journal Volume
- 25
- Journal Issue
- 4
- Journal Page Range
- p. 1427-1430
- ISSN
- 0256-307X
- CODEN
- CPLEEU
INIS
- Country of Publication
- China
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44112830
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- DIELECTRIC MATERIALS; ELECTRIC POTENTIAL; LEAKAGE CURRENT; MOSFET; OXIDES; STRESSES; TEMPERATURE DEPENDENCE; THIN FILMS; TUNNEL EFFECT
- Descriptors DEC
- CHALCOGENIDES; CURRENTS; ELECTRIC CURRENTS; FIELD EFFECT TRANSISTORS; FILMS; MATERIALS; MOS TRANSISTORS; OXYGEN COMPOUNDS; SEMICONDUCTOR DEVICES; TRANSISTORS