International round robin test of the retained critical current after double bending at room temperature of Ag-sheathed Bi-2223 superconducting wires
- 1. Superconductivity Technology Division, Sumitomo Electric Industries, Ltd., Shimaya 1-1-3, Kohohana-ku, Osaka 554-0024 (Japan)
- 2. Magnet Development Group, National Institute for Materials Science, 3-13 Sakura, Tsukuba 305-0003 (Japan)
- 3. Research Institute for Applied Sciences, Sakyo-ku Tanaka, Kyoto 606-8202 (Japan)
- 4. Department of Mechanical Design Engineering, Andong National University, 1375 Kyungdong-Ro, Andong, Kyungbuk 760-749 (Korea, Republic of)
- 5. Institute for Technical Physics, Karlsruhe Institute of Technology, D-76344 Eggenstein-Leopoldshafen (Germany)
- 6. Department of Electrical, Electronic and Information Engineering, University of Bologna, Viale Risorgimento 2, I-40136, Bologna (Italy)
Description
An international round robin test was carried out in order to establish a test method for retained critical current after double bending at room temperature of Ag-sheathed Bi-2223 superconducting wires. Tests for commercial Bi-2223 tape were conducted by six laboratories using the same guidelines. The standard uncertainties (SUs) of measurands were evaluated for these four quantities: I C0, I C/I C080, I C/I C060, I C/I C050, where, I C0 is initial critical current and I C /I C0XX is critical current after XX mm bending. Using an F test to determine where the most scatter was generated in the test results it was found that the greatest scatter in the normalized critical current measurements came from inter-laboratory scatter. In a type-B uncertainty evaluation, the major contribution was from the bending diameter and measuring temperature. The relative SU tended to increase as the bending diameter decreased. A specific mandrel diameter corresponding to a retained critical current of 95% could be determined with a relative SU of 1.3%. In order to reduce the overall scatter, the temperature difference between the critical current measurements before and after bending should be small. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0953-2048/29/2/025010Additional details
Identifiers
Publishing Information
- Journal Title
- Superconductor Science and Technology
- Journal Volume
- 29
- Journal Issue
- 2
- Journal Page Range
- [10 p.]
- ISSN
- 0953-2048
- CODEN
- SUSTEF
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47103003
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; S36: MATERIALS SCIENCE;
- Descriptors DEI
- BENDING; BISMUTH COMPOUNDS; CRITICAL CURRENT; EVALUATION; SILVER COMPOUNDS; SUPERCONDUCTING WIRES
- Descriptors DEC
- CURRENTS; DEFORMATION; ELECTRIC CURRENTS; TRANSITION ELEMENT COMPOUNDS; WIRES