Dynamic Ni gettered by PSG from S-MIC poly-Si and its TFTs
Creators
- 1. Institute of Photo-electronics of Nankai University, Tianjin key laboratory for Photo-electronic thin film devices and Technology, Tianjin Key Laboratory of Photo-electronic Thin Film Devices and Technology, Tianjin 300071 (China)
- 2. Department of electronic and computer engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong (Hong Kong)
Description
A dynamic phosphor-silicate glass (PSG) gettering method is proposed in which the processes of the gettering of Ni by PSG and the crystallizing of α-Si into poly-Si by Ni take place simultaneously. The effects of PSG gettering process on the performances of solution-based metal induced crystallized (S-MIC) poly-Si materials and their thin film transistors (TFTs) are discussed. The crystallization rate is much reduced due to the fact that the Ni as a medium source of crystallization is extracted by the PSG during crystallization at the same time. The boundary between two neighbouring grains in S-MIC poly-Si with PSG looks blurrier than without PSG. Compared with the TFTs made from S-MIC poly-Si without PSG gettering, the TFTs made with PSG gettering has a reduced gate induced leakage current
Availability note (English)
Available from http://dx.doi.org/10.1088/1674-1056/17/4/044Additional details
Identifiers
Publishing Information
- Journal Title
- Chinese Physics. B
- Journal Volume
- 17
- Journal Issue
- 4
- Journal Page Range
- p. 1415-1420
- ISSN
- 1674-1056
INIS
- Country of Publication
- China
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44124991
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- COMPARATIVE EVALUATIONS; CRYSTALLIZATION; GETTERING; GLASS; LEAKAGE CURRENT; NICKEL; PERFORMANCE; SILICATES; SILICON; THIN FILMS; TRANSISTORS
- Descriptors DEC
- CURRENTS; ELECTRIC CURRENTS; ELEMENTS; EVALUATION; FILMS; METALS; OXYGEN COMPOUNDS; PHASE TRANSFORMATIONS; SEMICONDUCTOR DEVICES; SEMIMETALS; SILICON COMPOUNDS; TRANSITION ELEMENTS