Published 1989
| Version v1
Book
Electron swarms in two phase plasmas
Creators
- 1. Illinois Univ., Urbana, IL (USA). Gaseous Electronics Lab.
Description
In this paper, the simulation will be described and the effect of particulate matter on the EEDF and electron transport coefficients in partially ionized plasmas will be discussed. The authors find that for typical plasmas (gas pressure 3--10 Torr, electron density 109--1012 cm-3) particulate densities in excess of 104--105 are required to significantly perturb the EEDF. In this range, the rate coefficient for electron impact ionization is decreased sufficiently that the self sustaining voltage of a positive column discharge will increase. The local constriction of current by the occluding effects of the sheath is also discussed
Additional details
Publishing Information
- Publisher
- IEEE Service Center.
- Imprint Place
- Piscataway, NJ (USA)
- Imprint Title
- Proceedings of the 1989 IEEE international conference on plasma science (Abstracts)
- Imprint Pagination
- 180 p.
- Journal Page Range
- p. 130.
Conference
- Title
- Institute of Electrical and Electronics Engineers international conference on plasma science.
- Dates
- 22-24 May 1989.
- Place
- Buffalo, NY (USA).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 21069040
- Subject category
- S70: PLASMA PHYSICS AND FUSION TECHNOLOGY; S70: PLASMA PHYSICS AND FUSION TECHNOLOGY; S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ATOM-MOLECULE COLLISIONS; CHEMICAL REACTIONS; DISTRIBUTION FUNCTIONS; DRIFT INSTABILITY; ELECTRIC DISCHARGES; ELECTRODES; ELECTRON DRIFT; GASES; HYBRID RESONANCE; ION DRIFT; LOW TEMPERATURE; MONTE CARLO METHOD; PHASE STUDIES; PLASMA; PLASMA INSTABILITY; PLASMA SHEATH; PLASMA SIMULATION; SOLIDS; SPUTTERING; TWO-PHASE FLOW
- Descriptors DEC
- ATOM COLLISIONS; COLLISIONS; FLUID FLOW; FLUIDS; INSTABILITY; MOLECULE COLLISIONS; RESONANCE; SIMULATION
Optional Information
- Secondary number(s)
- CONF-8905184--.