Published May 1998
| Version v1
Journal article
Picosecond ultrasonics study of the modification of interfacial bonding by ion implantation
- 1. Department of Physics, Brown University, Providence, Rhode Island02912 (United States)
- 2. Department of Physics, University of Florida, Gainesville, Florida32611 (United States)
Description
We report on experiments in which picosecond ultrasonic techniques are used to investigate the modification of interfacial bonding that results from ion implantation. The bonding is studied through measurements of the acoustic reflection coefficient at the interface. This method is nondestructive and can be used to create a map of the variation of the bonding over the area of the interface. copyright 1998 American Institute of Physics
Additional details
Publishing Information
- Journal Title
- Applied Physics Letters
- Journal Volume
- 72
- Journal Issue
- 18
- Journal Page Range
- p. 2235-2237
- ISSN
- 0003-6951
- CODEN
- APPLAB
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 29047928
- Subject category
- S42: ENGINEERING; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ADHESION; CHEMICAL BONDS; GOLD; HELIUM IONS; INTERFACES; ION IMPLANTATION; MEV RANGE 01-10; NONDESTRUCTIVE ANALYSIS; REFLECTION; SILICON; THIN FILMS; ULTRASONIC TESTING
- Descriptors DEC
- ACOUSTIC TESTING; CHARGED PARTICLES; CHEMICAL ANALYSIS; ELEMENTS; ENERGY RANGE; FILMS; IONS; MATERIALS TESTING; METALS; MEV RANGE; NONDESTRUCTIVE TESTING; SEMIMETALS; TESTING; TRANSITION ELEMENTS