Published December 1, 2015 | Version v1
Journal article

Physical characterization of sputter-deposited amorphous tungsten oxynitride thin films

  • 1. Department of Mechanical Engineering, University of Texas at El Paso, El Paso, TX 79968 (United States)
  • 2. Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson Air Force Base (WPAFB), Dayton, OH 45433 (United States)
  • 3. Amethyst Research Inc., 123 Case Circle, Ardmore, OK 73401 (United States)

Description

Tungsten oxynitride (W–O–N) thin films were deposited onto silicon (100) and quartz substrates using direct current (DC) sputtering. Composition variations in the W–O–N films were obtained by varying the nitrogen gas flow rate from 0 to 20 sccm, while keeping the total gas flow constant at 40 sccm using 20 sccm of argon with the balance comprised of oxygen. The resulting crystallinity, optical properties, and chemical composition of the DC sputtered W–O–N films were evaluated. All the W–O–N films measured were shown to be amorphous using X-ray diffraction. Spectrophotometry results indicate that the optical parameters, namely, the transmission magnitude and band gap (Eg), are highly dependent on the nitrogen content in the reactive gas mixture. Within the W–O–N system, Eg was able to be precisely tailored between 2.9 eV and 1.9 eV, corresponding to fully stoichiometric WO3 and highly nitrided W–O–N, respectively. Rutherford backscattering spectrometry (RBS) coupled with X-ray photoelectron spectroscopy (XPS) measurements indicate that the composition of the films varies from WO3 to W–O–N composite oxynitride films. - Highlights: • W–O–N films of ~ 100 nm thick were sputter-deposited by varying nitrogen gas flow rate. • Nitrogen incorporation into W-oxide is effective at or after 9 sccm flow rate of nitrogen. • The band gap significantly decreases from ~ 3.0 eV to ~ 2.1 eV with progressive increase in nitrogen content. • A composite oxide-semiconductor of W–O–N is proposed to explain the optical properties

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2015.08.066

Additional details

Identifiers

DOI
10.1016/j.tsf.2015.08.066;
PII
S0040-6090(15)00935-9;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
596
Journal Page Range
p. 160-166
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
42. international conference on metallurgical coatings and thin films
Acronym
ICMCTF 2015
Dates
20-24 Apr 2015
Place
San Diego, CA (United States)

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.