XPS and AES investigations of the adhesive bonding properties of thin titanium coatings

The bonding properties of PMMA-microstructures on Ti-coated Cu-substrates after an oxidative treatment in alkaline hydrogenperoxide solution were investigated. In order to clarify the basic mechanism, surface analytical investigations by XPS-, AES-, and depth profile measurements have been performed. It was demonstrated that for optimum bonding a TiO2 surface layer of ca. 30 nm thickness is necessary. Chemical effects as well as a mechanical bonding with open grain boundary structures (dimensions in the μm-range) could be ruled out as bonding mechanisms. A mechanical interlocking of the polymer with micropores (dimensions in the nm-range) of the oxidic overlayer is adopted as the most probable bonding mechanism. (orig.)