Published 1999 | Version v1
Book

Molecular dynamics simulation of neutron damage in β-SiC

  • 1. Univ. Politecnica, Madrid (Spain). Inst. de Fusion Nuclear
  • 2. Lawrence Livermore National Lab., CA (United States). Chemistry and Materials Div.

Description

Molecular Dynamics (MD) simulations of neutron damage in β-SiC have been performed using a modified version of the Tersoff potential. The Threshold Displacement Energy (TDE) for Si and C atoms at 300 K has been determined along directions [001], [110], [111] and [bar 1 bar 1 bar 1]. The existence of recombination barriers, which allow the formation of metastable, temperature-sensitive defects even below the threshold, has been observed. Displacement cascades produced by both C- and Si-recoils of energies spanning from 0.5 keV up to, respectively, 5 keV and 8 keV have also been simulated at 300 K and 1300 K. Their analysis, together with the analysis of damage accumulation (∼3.4 x 10-3 DPA) at 1300 K, reveals that the two sub-lattices exhibit opposite responses to irradiation: whereas only a little damage is produced on the ductile Si sub-lattice, many point-defects accumulate on the much more fragile C sub-lattice. A preliminary study of the nature and clustering tendency of these defects is performed. The possibility of disorder-induced amorphization is considered and the preliminary result is that no amorphization takes place at the dose and temperature simulated

Additional details

Publishing Information

Publisher
Materials Research Society
Imprint Place
Warrendale, PA (United States)
ISBN
1-55899-446-7
Imprint Title
Microstructural processes in irradiated materials
Imprint Pagination
754 p.
Series
Materials Research Society symposium proceedings, Volume 540
Journal Page Range
p. 171-176
ISSN
0272-9172

Conference

Title
1998 Fall Meeting of the Materials Research Society
Dates
30 Nov - 4 Dec 1998
Place
Boston, MA (United States)

Optional Information

Contract/Grant/Project number
Contract W-7405-ENG-48
Funding organization
USDOE, Washington, DC (United States)
Secondary number(s)
CONF-981104--