Published November 3, 2014 | Version v1
Journal article

In-situ doping of erbium in hydrogenated amorphous carbon by low temperature metalorganic radio frequency plasma enhanced chemical vapor deposition

  • 1. Department of Electrical and Computer Engineering, University of Toronto, ON M5S 3G4 (Canada)
  • 2. Department of Electrophysics, National Chiao Tung University, Hsinchu 30010, Taiwan (China)
  • 3. Centre for Interdisciplinary Science, National Chiao Tung University, Hsinchu 30010, Taiwan (China)
  • 4. Department of Materials Science and Engineering, I-Shou University, Kaohsiung 84001, Taiwan (China)
  • 5. Department of Materials Science and Engineering, University of Toronto, ON M5S 3E4 (Canada)

Description

A significant improvement in the photoluminescence of erbium doped amorphous carbon (a-C:H(Er)) is reported. The effects of the RF power on the anode and cathode a-C:H films were investigated in terms of the microstructural and local bonding features. It was determined that Er doped a-C:H films should be placed on the anode to obtain wider bandgap and lower percentage of sp2 carbon bonding. The metalorganic compound, tris(6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionate) Erbium(+ III) or Er(fod)3, was incorporated in-situ into an a-C:H host by metalorganic rf plasma enhanced chemical vapor deposition. This technique provides the capability of doping Er in a vertically uniform profile. The high erbium concentration (3.9 at.%), partial fluorination of the surrounding ligands, and the large optical bandgap of the host a-C:H are the primary factors that enable enhancement of the photoluminescence. - Highlights: • High and uniform Er concentration (3.9 at.%) in a-C:H(Er) films is achieved. • Room-temperature photoluminescence peaking at 1.54 μm is demonstrated. • Optically active Er3+ ions are preserved in as-grown samples at low growth temperature. • Non-radiative C-H vibrational quenching is reduced by fluorination of a-C host. • Metalorganic-RF-PECVD provides the potential of doping Er in vertically uniform profiles

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2014.02.038

Additional details

Identifiers

DOI
10.1016/j.tsf.2014.02.038;
PII
S0040-6090(14)00173-4;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
570
Journal Issue
Part B
Journal Page Range
p. 429-435
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
International thin films conference
Acronym
TACT 2013
Dates
5-9 Oct 2013
Place
Taipei, Taiwan (China)

Optional Information

Copyright
Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.