Published September 2, 1991 | Version v1
Journal article

Wet etch process for patterning insulators suitable for epitaxial high Tc superconducting thin film multilevel electronic circuits

  • 1. IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York (USA)

Description

We describe a wet etch process for patterning insulators suitable for multilayer epitaxial highTc superconductor-insulator-superconductor structures down to micronmeter-scale dimensions. A solution of 7% HF in water gives convenient etch rates for SrTiO3 and MgO insulators (about 1500 A/min for single crystals), and easily stops on thin high Tc superconducting layers, due to the high selectivity of this etchant between these insulators and the cuprate superconductors. Using entirely wet etching patterning processes, we have fabricated 5-turn (20-turn) coils with zero resistance at 89 K (79 K) and critical currents at 77 K of 2.5 mA (6 μA)

Additional details

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
59
Journal Issue
10
Series
Appl. Phys. Lett.
Journal Page Range
1257-1259
ISSN
0003-6951
CODEN
APPLA