Published December 15, 2006 | Version v1
Journal article

Gallium oxide (Ga2 O3) on gallium arsenide-A low defect, high-K system for future devices

  • 1. Nanoelectronics Research Centre, University of Glasgow, Glasgow G12 8QQ (United Kingdom)
  • 2. Freescale Semiconductor Inc., Tempe, AZ 85284 (United States)

Description

Test devices have been fabricated on a specially grown GaAs/AlGaAs wafer with a 10-bar nm Ga2 O3 gate dielectric. The wafer has two GaAs transport channels either side of an AlGaAs barrier containing a δ-doping layer. Gate leakage measurements with different gate metals show that transport is by a single activated channel and is dependent on the gate metal work function. C-V studies show that there is little pinning at the oxide-semiconductor interface and confirm the threshold voltage dependence on the gate metal work function. Lateral transport studies are able to distinguish the contribution of the two channels, and there is some indication of reduction of mobility in the channel nearest the oxide. We conclude that, although the oxide is of high quality, the leakage current activation energies are too low for low power device applications without an additional large band-gap oxide also being present

Additional details

Identifiers

DOI
10.1016/j.mseb.2006.08.026;
PII
S0921-5107(06)00471-5;

Publishing Information

Journal Title
Materials Science and Engineering. B, Solid-State Materials for Advanced Technology
Journal Volume
135
Journal Issue
3
Journal Page Range
p. 277-281
ISSN
0921-5107
CODEN
MSBTEK

Conference

Title
Symposium B: From strained silicon to nanotubes - Novel channels for field effect devices
Acronym
E-MRS IUMRS ICEM 2006
Dates
29 May - 2 Jun 2006
Place
Nice (France)

Optional Information

Copyright
Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.