Published June 1995 | Version v1
Journal article

Thermodynamic simulation of YBa2Cu3O6+x film growth using aerosol MOCVD

  • 1. INPG-ENSPG-LMGP, 38 Saint-Martin d'Heres (France)
  • 2. INPG-ENSEEG-LTPCM, 38 Saint-Martin d'Heres (France)

Description

Future high power applications of high Tc superconducting materials (like YBa2Cu3O6+x) demand thick films with excellent electrical properties. The use of thin film deposition techniques is only possible when high deposition rates can be reached. A novel aerosol MOCVD technique using a liquid source has recently been developed and is very promising for this purpose. The precursor materials used are the β-diketonates of yttrium, barium and copper, dissolved in diethylene glycol dimethyl ether (''diglyme'') in various concentrations. A preliminary thermodynamic simulation of the process is a useful tool for a deeper understanding of the stability limits of the superconducting phase and the on-going reactions during deposition. The results of these simulations have been used to optimise the process conditions for YBa2Cu3O6+x growth with good superconducting properties. A comparison between the simulation and the experimental results will be given and the influence of the main process parameters (deposition temperature, oxygen partial pressure, precursor concentration, ..) will be shown. (orig.)

Additional details

Publishing Information

Journal Title
Journal de Physique. 4
Journal Volume
5
Journal Issue
5,pt.1
Series
Supplement to J. Phys., II v. 5(6). Proceedings.
Journal Page Range
p. 151-158.
ISSN
1155-4339
CODEN
JPICEI

Conference

Title
10. European conference on chemical vapour deposition (EUROCVD-10).
Dates
10-15 Sep 1995.
Place
Venice (Italy).

INIS