Method of cleaning metal sodium handling equipment
Description
Purpose: To clean and remove metal sodium in a short time from a metal sodium handling equipment. Method: Since the temperature rise due to the generation of heat upon reaction of steams and metal sodium has to be maintained at such a lower temperature usually about less than 100degC in view of the corrosion of material, the amount of the steams supplied is kept restricted to require long cleaning time. In view of the above, metal sodium is discharged from the equipment while being replaced with nitrogen gas and, thereafter, steam-containing helium gas is charged into the equipment to eliminate residual sodium. That is, helium having preferable heat conductivity (about 6-9 times greater than that of nitrogen and argon) is used as a medium capable of easy removing of reaction heat and preventing local temperature rise is used. Further, since helium has small molecular weight, it can rapidly prevail also to the upper portion of the equipment without stagnating in the lower portion thereof and can be eliminated in a short period of time. (Horiuchi, T. )
Availability note (English)
Available from JAPIO. Also available from INPADOC.Additional details
Publishing Information
- Imprint Pagination
- 3 p.
- IPC:
- Int. Cl. G21F9/28.
- IPC
- Int. Cl. G21F9/28.
- Patent number
- JP patent document 63-218898/A/
INIS
- Country of Publication
- Japan
- Country of Input or Organization
- Japan
- INIS RN
- 20049480
- Subject category
- S21: SPECIFIC NUCLEAR REACTORS AND ASSOCIATED PLANTS;
- Resource subtype / Literary indicator
- Non-conventional Literature
- Descriptors DEI
- CLEANING; DECONTAMINATION; HELIUM; LIQUID METALS; LMFBR TYPE REACTORS; NITROGEN; REACTION HEAT; REACTOR COMPONENTS; SODIUM; STEAM
- Descriptors DEC
- ALKALI METALS; BREEDER REACTORS; ELEMENTS; ENTHALPY; EPITHERMAL REACTORS; FAST REACTORS; FBR TYPE REACTORS; FLUIDS; LIQUID METAL COOLED REACTORS; LIQUIDS; METALS; NONMETALS; PHYSICAL PROPERTIES; RARE GASES; REACTORS; THERMODYNAMIC PROPERTIES
Optional Information
- Secondary number(s)
- JP patent application 62-52088.