Published January 14, 2016 | Version v1
Journal article

Evidence for thermally assisted threshold switching behavior in nanoscale phase-change memory cells

  • 1. IBM Research-Zurich, 8803 Rüschlikon (Switzerland)

Description

In spite of decades of research, the details of electrical transport in phase-change materials are still debated. In particular, the so-called threshold switching phenomenon that allows the current density to increase steeply when a sufficiently high voltage is applied is still not well understood, even though there is wide consensus that threshold switching is solely of electronic origin. However, the high thermal efficiency and fast thermal dynamics associated with nanoscale phase-change memory (PCM) devices motivate us to reassess a thermally assisted threshold switching mechanism, at least in these devices. The time/temperature dependence of the threshold switching voltage and current in doped Ge2Sb2Te5 nanoscale PCM cells was measured over 6 decades in time at temperatures ranging from 40 °C to 160 °C. We observe a nearly constant threshold switching power across this wide range of operating conditions. We also measured the transient dynamics associated with threshold switching as a function of the applied voltage. By using a field- and temperature-dependent description of the electrical transport combined with a thermal feedback, quantitative agreement with experimental data of the threshold switching dynamics was obtained using realistic physical parameters

Additional details

Identifiers

Publishing Information

Journal Title
Journal of Applied Physics
Journal Volume
119
Journal Issue
2
Journal Page Range
p. 025704-025704.9
ISSN
0021-8979
CODEN
JAPIAU

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47065117
Subject category
S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
Descriptors DEI
CURRENT DENSITY; DOPED MATERIALS; ELECTRIC POTENTIAL; FEEDBACK; NANOSTRUCTURES; PHASE CHANGE MATERIALS; TEMPERATURE DEPENDENCE; THERMAL EFFICIENCY; TRANSIENTS
Descriptors DEC
EFFICIENCY; MATERIALS

Optional Information

Notes
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