Published December 5, 2006
| Version v1
Journal article
An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples
Creators
- 1. Department of Materials Science and Engineering, National Tsing-Hua University, 101 Sec. 2 Kuang-Fu Rd., Hsinchu, Taiwan 30013 (China)
Description
Growth kinetics of Cu6Sn5 and Cu3Sn compounds in Cu/Sn thin film couples was studied by in situ resistivity measurements and X-ray diffraction analysis. The Cu6Sn5 and Cu3Sn intermetallic compounds were found to form in sequence when the Cu/Sn bimetallic samples were isochronally annealed from room temperature to 220 deg. C. A kinetic model was presented to explain sequential appearance of the Cu6Sn5 phase and the Cu3Sn phase during the isochronal annealing process. The activation energies of Cu6Sn5 and Cu3Sn compound growth in Cu/Sn thin film couples were determined from the in situ resistivity measurements to be 0.87 eV and 1.05 eV, respectively
Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2006.05.025;
- PII
- S0040-6090(06)00670-5;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 515
- Journal Issue
- 4
- Journal Page Range
- p. 2781-2785
- ISSN
- 0040-6090
- CODEN
- THSFAP
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 38058267
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ACTIVATION ANALYSIS; ACTIVATION ENERGY; ANNEALING; COPPER ALLOYS; ELECTRICAL PROPERTIES; EV RANGE 01-10; INTERMETALLIC COMPOUNDS; KINETICS; TEMPERATURE RANGE 0273-0400 K; TEMPERATURE RANGE 0400-1000 K; THIN FILMS; TIN ALLOYS; X-RAY DIFFRACTION
- Descriptors DEC
- ALLOYS; CHEMICAL ANALYSIS; COHERENT SCATTERING; DIFFRACTION; ENERGY; ENERGY RANGE; EV RANGE; FILMS; HEAT TREATMENTS; NONDESTRUCTIVE ANALYSIS; PHYSICAL PROPERTIES; SCATTERING; TEMPERATURE RANGE; TRANSITION ELEMENT ALLOYS
Optional Information
- Copyright
- Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.