Update on plasma arc centrifugal treatment
Description
Over the last eight years, Retech has developed a plasma-powered system for destroying organics and stabilizing metal oxides in a non-leaching slag. The system, termed Plasma Arc Centrifugal Treatment (PACT), can handle a variety of waste streams such as contaminated soils, sludges, ion-exchange resins, incinerator bottom and fly-ash and drummed waste among others. This paper will review recent commercial applications of the technology. Three Plasma Arc Centrifugal Treatment systems having an eight-foot diameter centrifuge (PACT-8) are in the construction phase. One will be used in the Lockheed Environmental Systems and Technologies (LESAT) system for remediating Pit 9 at the Idaho National Engineering Lab (INEL). A second unit will be located at the Retech plant in Ukiah, California. The third unit will be located at a site in Munster, Germany
Additional details
Publishing Information
- Publisher
- American Nuclear Society, Inc.
- Imprint Place
- La Grange Park, IL (United States)
- Imprint Title
- Proceedings of the international topical meeting on nuclear and hazardous waste management (SPECTRUM '96): Volume 1
- Imprint Pagination
- 885 p.
- Journal Page Range
- p. 844-850.
Conference
- Title
- international conference on nuclear and hazardous waste management.
- Acronym
- SPECTRUM '96
- Dates
- 18-23 Aug 1996.
- Place
- Seattle, WA (United States).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 28050573
- Subject category
- S12: MANAGEMENT OF RADIOACTIVE WASTES, AND NON-RADIOACTIVE WASTES FROM NUCLEAR FACILITIES;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- DECOMPOSITION; HAZARDOUS MATERIALS; HEAT TREATMENTS; PLASMA GUNS; RADIOACTIVE WASTE PROCESSING; RADIOACTIVE WASTES; STABILITY
- Descriptors DEC
- CHEMICAL REACTIONS; MANAGEMENT; MATERIALS; RADIOACTIVE MATERIALS; WASTE MANAGEMENT; WASTE PROCESSING; WASTES
Optional Information
- Secondary number(s)
- CONF-960804--Vol.1.