Nucleation of nickel disilicide precipitates in float-zone silicon. The role of vacancies
- 1. 4th Physical Institute - Solids and Nanostructures, University of Goettingen, Göttingen, 37077 (Germany)
- 2. Leibniz-Institut für Kristallzüchtung (IKZ), Berlin, D-12489 (Germany)
Description
Nickel is one of the fast diffusion transition metal impurities in silicon that tends to form precipitates during cooling from processing temperature. The typically observed NiSi plate-shaped precipitates are well-understood from structural and electrical perspectives with the exception of the initial stages of particle nucleation. Herein, the fact that excess vacancies bound into nitrogen-vacancy complexes react with interstitial nickel to form substitutional nickel atoms, Ni is exploited. Furthermore, excess vacancies can be removed by thermal annealing thus providing a scheme, where nickel precipitation can be studied with and without the presence of Ni. It is shown by deep-level transient spectrocopy (DLTS) that Ni considerably enhances nickel precipitate nucleation by reducing the nucleation barrier by about 1.7 eV and that Ni is consumed by precipitate formation. Simple energy considerations and an atomistic model of particle nucleation will be discussed. (© 2022 The Authors. physica status solidi (a) applications and materials science published by Wiley‐VCH GmbH)
Availability note (English)
Available from: http://dx.doi.org/10.1002/pssa.202200220Additional details
Identifiers
Publishing Information
- Journal Title
- Physica Status Solidi. A, Applications and Materials Science (Online)
- Journal Volume
- 219
- Journal Issue
- 17
- Journal Page Range
- p. 1-10
- ISSN
- 1862-6319
- CODEN
- PSSABA
INIS
- Country of Publication
- Germany
- Country of Input or Organization
- Germany
- INIS RN
- 53109999
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ANNEALING; DEEP LEVEL TRANSIENT SPECTROSCOPY; DIFFUSION BARRIERS; ETCHING; IMPURITIES; INTERSTITIALS; NICKEL ADDITIONS; NICKEL SILICIDES; NUCLEATION; PRECIPITATION; PROCESSING; SCANNING ELECTRON MICROSCOPY; SILICON; TEMPERATURE DEPENDENCE; TRANSMISSION ELECTRON MICROSCOPY; VACANCIES
- Descriptors DEC
- ALLOYS; CRYSTAL DEFECTS; CRYSTAL STRUCTURE; ELECTRON MICROSCOPY; ELEMENTS; HEAT TREATMENTS; MICROSCOPY; NICKEL ALLOYS; NICKEL COMPOUNDS; POINT DEFECTS; SEMIMETALS; SEPARATION PROCESSES; SILICIDES; SILICON COMPOUNDS; SPECTROSCOPY; SURFACE FINISHING; TRANSITION ELEMENT ALLOYS; TRANSITION ELEMENT COMPOUNDS
Optional Information
- Notes
- AID: 2200220; Gettering and defect engineering in semiconductor technology (GADEST 2022)