Published September 10, 2010 | Version v1
Journal article

Size dependence of creep behavior in nanoscale Cu/Co multilayer thin films

  • 1. National Key Lab for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072 (China)
  • 2. Laboratory of Advanced Materials, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084 (China)

Description

Research highlights: → Cu/Co superlattice structure forms with decreasing periodicity. → It exhibits size dependence of the creep behavior and power-law creep parameters. → A dislocation model for steady-state deformation of semi-coherent films is presented. → Nanoscale effects are related to dislocation generation and annihilation at interfaces. - Abstract: Cu/Co multilayers with periodicity of 4-40 nm were prepared by electron beam evaporation deposition. Microstructure and room temperature creep behavior were investigated by X-ray diffraction, transmission electron microscopy and nanoindentation test. The results show that superlattice structure forms with decreasing periodicity and coherent interfaces come into being at low periodicity of 4 nm. Size dependence of the creep behavior is observed and power-law creep parameters including stress exponent and size sensitivity index are calculated by dimension analysis. A dislocation model for predicting the steady-state deformation of multilayers with semi-coherent interfaces is presented. Nanoscale effects are explained by dislocation generation and annihilation mechanisms involving single dislocations slip in confined layers and dislocations climb at the interfaces, respectively. Model predictions agree well with experimental observation.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jallcom.2010.07.024

Additional details

Identifiers

DOI
10.1016/j.jallcom.2010.07.024;
PII
S0925-8388(10)01706-8;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
506
Journal Issue
1
Journal Page Range
p. 434-440
ISSN
0925-8388
CODEN
JALCEU

Optional Information

Copyright
Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.