Thermal Spray Coating of Tungsten for Tokamak Device
Creators
- 1. Institute of Surface and Coatings Technology, Central South University, Changsha 410083 (China)
- 2. Plasma Technology Research Center, University of Sherbrooke, Sherbrooke, J1K 2R1 (Canada)
Description
Thermal spray, such as direct current (d.c.) plasma spray or radio frequency induced plasma spray, was used to deposit tungsten coatings on the copper electrodes of a tokamak device. The tungsten coating on the outer surface of one copper electrode was formed directly through d.c. plasma spraying of fine tungsten powder. The tungsten coating/lining on the inner surface of another copper electrode could be formed indirectly through induced plasma spraying of coarse tungsten powder. Scanning electron microscopy (SEM) was used to examine the cross section and the interface of the tungsten coating. Energy Dispersive Analysis of X-ray (EDAX) was used to analyze the metallic elements attached to a separated interface. The influence of the particle size of the tungsten powder on the density, cracking behavior and adhesion of the coating is discussed. It is found that the coarse tungsten powder with the particle size of 45 ∼ 75 μm can be melted and the coating can be formed only by using induced plasma. The coating deposited from the coarse powder has much higher cohesive strength, adhesive strength and crack resistance than the coating made from the fine powder with a particle size of 5 μm
Availability note (English)
Available online at http://stacks.iop.org/1009-0630/8/164/pst6_2_008.pdf or at the Web site for the journal Plasma Science and Technology (ISSN 1009-0630) http://www.iop.org/Additional details
Identifiers
Publishing Information
- Journal Title
- Plasma Science and Technology
- Journal Volume
- 8
- Journal Issue
- 2
- Journal Page Range
- p. 164-167
- ISSN
- 1009-0630
INIS
- Country of Publication
- China
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 38009727
- Subject category
- S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
- Descriptors DEI
- ADHESION; ADHESIVES; COPPER; CRACKING; DIRECT CURRENT; ELECTRODES; INTERFACES; PARTICLE SIZE; PLASMA; POWDERS; RADIOWAVE RADIATION; SCANNING ELECTRON MICROSCOPY; SPRAY COATING; SPRAYED COATINGS; TOKAMAK DEVICES; TUNGSTEN; X RADIATION
- Descriptors DEC
- CHEMICAL REACTIONS; CLOSED PLASMA DEVICES; COATINGS; CURRENTS; DECOMPOSITION; DEPOSITION; ELECTRIC CURRENTS; ELECTROMAGNETIC RADIATION; ELECTRON MICROSCOPY; ELEMENTS; IONIZING RADIATIONS; METALS; MICROSCOPY; PYROLYSIS; RADIATIONS; REFRACTORY METALS; SIZE; SURFACE COATING; THERMOCHEMICAL PROCESSES; THERMONUCLEAR DEVICES; TRANSITION ELEMENTS