Published October 2007 | Version v1
Journal article

Modelling of Plasma Surface Interaction

  • 1. Center for Atomic and Molecular Technologies, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871 (Japan)
  • 2. Coordination Research Center, National Institute of Fusion Science, 322-6 Oroshi-cho, Toki, GIFU 509-5292 (Japan)
  • 3. Diamond Research Center, National Institute of Advanced Industrial Science and Technology, 1-8-31 Midorigaoka, Ikeda, Osaka 563-8577 (Japan)

Description

Molecular dynamics (MD) simulations are used to investigate chemical reactions that take place on surfaces exposed to ion bombardment and neutral radicals extracted from plasmas. Such chemical reactions occur in a nano-meter-scale thin top layer of the material and their characteristics significantly differ from those of ordinary chemical reactions in thermodynamical equilibrium. As applications of MD simulations to microscale fabrication and thin film formation processes, recent MD simulation results on organic polymer etching by hydrogen/nitrogen plasmas and surface diffusion of Si on highly hydrogenated Si surfaces are reviewed

Additional details

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
86
Journal Issue
1
Journal Page Range
p. 012016
ISSN
1742-6596

Conference

Title
5. EU - Japan joint symposium on plasma processing
Dates
7-9 Mar 2007
Place
Belgrade (Serbia)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
39031697
Subject category
S74: ATOMIC AND MOLECULAR PHYSICS;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CHEMICAL REACTIONS; COMPUTERIZED SIMULATION; DIFFUSION; EQUILIBRIUM; ETCHING; HYDROGEN; ION COLLISIONS; MOLECULAR DYNAMICS METHOD; NITROGEN; ORGANIC POLYMERS; PLASMA; RADICALS; SURFACES; THIN FILMS
Descriptors DEC
CALCULATION METHODS; COLLISIONS; ELEMENTS; FILMS; NONMETALS; ORGANIC COMPOUNDS; POLYMERS; SIMULATION; SURFACE FINISHING