Published October 2007
| Version v1
Journal article
Modelling of Plasma Surface Interaction
- 1. Center for Atomic and Molecular Technologies, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871 (Japan)
- 2. Coordination Research Center, National Institute of Fusion Science, 322-6 Oroshi-cho, Toki, GIFU 509-5292 (Japan)
- 3. Diamond Research Center, National Institute of Advanced Industrial Science and Technology, 1-8-31 Midorigaoka, Ikeda, Osaka 563-8577 (Japan)
Description
Molecular dynamics (MD) simulations are used to investigate chemical reactions that take place on surfaces exposed to ion bombardment and neutral radicals extracted from plasmas. Such chemical reactions occur in a nano-meter-scale thin top layer of the material and their characteristics significantly differ from those of ordinary chemical reactions in thermodynamical equilibrium. As applications of MD simulations to microscale fabrication and thin film formation processes, recent MD simulation results on organic polymer etching by hydrogen/nitrogen plasmas and surface diffusion of Si on highly hydrogenated Si surfaces are reviewed
Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Physics. Conference Series (Online)
- Journal Volume
- 86
- Journal Issue
- 1
- Journal Page Range
- p. 012016
- ISSN
- 1742-6596
Conference
- Title
- 5. EU - Japan joint symposium on plasma processing
- Dates
- 7-9 Mar 2007
- Place
- Belgrade (Serbia)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39031697
- Subject category
- S74: ATOMIC AND MOLECULAR PHYSICS;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- CHEMICAL REACTIONS; COMPUTERIZED SIMULATION; DIFFUSION; EQUILIBRIUM; ETCHING; HYDROGEN; ION COLLISIONS; MOLECULAR DYNAMICS METHOD; NITROGEN; ORGANIC POLYMERS; PLASMA; RADICALS; SURFACES; THIN FILMS
- Descriptors DEC
- CALCULATION METHODS; COLLISIONS; ELEMENTS; FILMS; NONMETALS; ORGANIC COMPOUNDS; POLYMERS; SIMULATION; SURFACE FINISHING