Proceedings of the 148. Annual Meeting and Exhibition on Microelectronic Packaging, Interconnect, and Pb-Free Solder

TMS2019 has presented more than 80 symposia planned by all five TMS technical divisions and covering a broad range of topics related to minerals, metals, and materials science and engineering. For your convenience, the symposia have been divided into the following technical tracks: additive technologies; materials processing; mechanics and structural reliability; corrosion; nuclear materials; physical metallurgy; light metals; characterization; nanostructured and heterostructured materials; advanced materials; electronic materials; energy and environment; biomaterials; materials design; and special topics. (O.M.)