Published April 30, 2014 | Version v1
Journal article

N-type doping of BaSi2 epitaxial films by phosphorus ion implantation and thermal annealing

  • 1. Core Research for Evolutional Science and Technology, Japan Science and Technology Agency, Gobancho, Chiyoda, Tokyo 102-0076 (Japan)
  • 2. Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603 (Japan)
  • 3. Advanced Research Laboratories, Tokyo City University, 8-15-1 Todoroki, Setagaya, Tokyo 158-0082 (Japan)
  • 4. Institute of Applied Physics, University of Tsukuba, 1-1-1 Tennohdai, Tsukuba, Ibaraki 305-8573 (Japan)

Description

Phosphorus doping by P implantation and thermal annealing of the BaSi2 epitaxial film grown on the Si(111) substrate has been studied. Raman spectroscopy results show that the structural damage due to P implantation can be almost removed by annealing within 30 and 1 s at 500 and 700 °C, respectively. The depth profile of P is investigated by secondary ion mass spectroscopy, which reveals considerably slower diffusion kinetics of P at 500 °C than 700 °C. The activation energy of the diffusion is roughly estimated to be 2 eV from the temperature dependence. The Hall measurement of the P-doped films clarifies that the P impurity is an electron donor in BaSi2. The average electron density up to the order of 1018 cm−3 is observed. - Highlights: • P doping of BaSi2 epitaxial films by ion implantation and thermal annealing is studied. • Damage is recovered within 30 and 1 s at 500 and 700 °C, respectively. • Considerably slower P diffusion is observed at 500 °C than 700 °C. • P impurity is revealed to be an electron donor in BaSi2. • The average electron density up to the order of 1018 cm−3 is observed

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2013.08.038

Additional details

Identifiers

DOI
10.1016/j.tsf.2013.08.038;
PII
S0040-6090(13)01330-8;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
557
Journal Page Range
p. 90-93
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
8. international conference on silicon epitaxy and heterostructures; ISCSI-VI: 6. international symposium on control of semiconductor interfaces
Acronym
ICSI-8
Dates
2-6 Jun 2013
Place
Fukuoka (Japan)

Optional Information

Copyright
Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.