Published August 1, 2017 | Version v1
Journal article

Evaluation of thin discontinuities in planar conducting materials using the diffraction of electromagnetic field

  • 1. National Institute of R and D for Technical Physics, Iasi (Romania)
  • 2. Zilina University, Faculty of Mechanical Engineering, Zilina (Slovakia)
  • 3. Institute of Physics of Materials AS CR v.v.i., Brno (Czech Republic)

Description

The current stage of nondestructive evaluation techniques imposes the development of new electromagnetic (EM) methods that are based on high spatial resolution and increased sensitivity. In order to achieve high performance, the work frequencies must be either radifrequencies or microwaves. At these frequencies, at the dielectric/conductor interface, plasmon polaritons can appear, propagating between conductive regions as evanescent waves. In order to use the evanescent wave that can appear even if the slits width is much smaller that the wavwelength of incident EM wave, a sensor with metamaterial (MM) is used. The study of the EM field diffraction against the edge of long thin discontinuity placed under the inspected surface of a conductive plate has been performed using the geometrical optics principles. This type of sensor having the reception coils shielded by a conductive screen with a circular aperture placed in the front of reception coil of emission reception sensor has been developed and "transported" information for obtaining of magnified image of the conductive structures inspected. This work presents a sensor, using MM conical Swiss roll type that allows the propagation of evanescent waves and the electromagnetic images are magnified. The test method can be successfully applied in a variety of applications of maxim importance such as defect/damage detection in materials used in automotive and aviation technologies. Applying this testing method, spatial resolution can be improved. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/1757-899X/227/1/012115

Additional details

Publishing Information

Journal Title
IOP Conference Series. Materials Science and Engineering (Online)
Journal Volume
227
Journal Issue
1
Journal Page Range
[8 p.]
ISSN
1757-899X

Conference

Title
5. international conference on modern technologies in industrial engineering
Acronym
ModTech2017
Dates
14-17 Jun 2017
Place
Sibiu (Romania)

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