Temperature profile and crater formation induced in high-current pulsed electron beam processing
- 1. State Key Laboratory of Materials Modification, Department of Physics, Dalian University of Technology, Dalian 116024 (China)
Description
We study in this article the formation mechanism of craters on a metal surface during the high current pulsed electron beam processing. Based on experimental investigations and a physical model, the melting process and their temperature profiles are simulated for substrates of aluminum and steels. Initial melting positions, crater depths, and melting layer thickness are computed, the results being in a good agreement with experimental data. It is also confirmed that the temperature rises faster at a subsurface layer instead of at the outermost surface due to the maximum energy deposition located at about 1/3 of the total penetration depth of the beam. Such a subsurface layer heating and melting mechanism causes eruptions of the subsurface layer liquid matters through the outermost surface and produces the typical surface crater morphology
Additional details
Identifiers
- DOI
- 10.1116/1.1619417;
Publishing Information
- Journal Title
- Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
- Journal Volume
- 21
- Journal Issue
- 6
- Journal Page Range
- p. 1934-1938
- ISSN
- 0734-2101
- CODEN
- JVTAD6
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 36027947
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; S36: MATERIALS SCIENCE;
- Descriptors DEI
- ALUMINIUM; ELECTRON BEAMS; ENERGY BEAM DEPOSITION; LAYERS; MELTING; MORPHOLOGY; PENETRATION DEPTH; STEELS; SURFACE TREATMENTS
- Descriptors DEC
- ALLOYS; BEAMS; CARBON ADDITIONS; DEPOSITION; ELEMENTS; IRON ALLOYS; IRON BASE ALLOYS; LEPTON BEAMS; METALS; PARTICLE BEAMS; PHASE TRANSFORMATIONS; SURFACE COATING; TRANSITION ELEMENT ALLOYS
Optional Information
- Notes
- (c) 2003 American Vacuum Society.