Published May 25, 2017 | Version v1
Journal article

Passive thermal management system for downhole electronics in harsh thermal environments

Description

Highlights: • A passive thermal management system is proposed for downhole electronics. • Electronics temperature can be maintained within 125 °C for six-hour operating time. • The result shows potential application for the logging tool in oil and gas industry. - Abstract: The performance and reliability of downhole electronics will degrade in high temperature environments. Various active cooling techniques have been proposed for thermal management of such systems. However, these techniques require additional power input, cooling liquids and other moving components which complicate the system. This study presents a passive Thermal Management System (TMS) for downhole electronics. The TMS includes a vacuum flask, Phase Change Material (PCM) and heat pipes. The thermal characteristics of the TMS is evaluated experimentally. The results show that the system maintains equipment temperatures below 125 °C for a six-hour operating period in a 200 °C downhole environment, which will effectively protect the downhole electronics.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.applthermaleng.2017.01.118

Additional details

Identifiers

DOI
10.1016/j.applthermaleng.2017.01.118;
PII
S1359-4311(16)32418-8;

Publishing Information

Journal Title
Applied Thermal Engineering
Journal Volume
118
Journal Page Range
p. 593-599
ISSN
1359-4311
CODEN
ATENFT

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
48063604
Subject category
S42: ENGINEERING;
Descriptors DEI
CASKS; COOLING; ELECTRONIC EQUIPMENT; HEAT PIPES; HEAT STORAGE; PETROLEUM INDUSTRY; PHASE CHANGE MATERIALS; POWER INPUT; RELIABILITY; TEMPERATURE RANGE 0400-1000 K; THERMAL INSULATION
Descriptors DEC
CONTAINERS; ENERGY STORAGE; EQUIPMENT; INDUSTRY; MATERIALS; STORAGE; TEMPERATURE RANGE

Optional Information

Copyright
Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.