Passive thermal management system for downhole electronics in harsh thermal environments
Description
Highlights: • A passive thermal management system is proposed for downhole electronics. • Electronics temperature can be maintained within 125 °C for six-hour operating time. • The result shows potential application for the logging tool in oil and gas industry. - Abstract: The performance and reliability of downhole electronics will degrade in high temperature environments. Various active cooling techniques have been proposed for thermal management of such systems. However, these techniques require additional power input, cooling liquids and other moving components which complicate the system. This study presents a passive Thermal Management System (TMS) for downhole electronics. The TMS includes a vacuum flask, Phase Change Material (PCM) and heat pipes. The thermal characteristics of the TMS is evaluated experimentally. The results show that the system maintains equipment temperatures below 125 °C for a six-hour operating period in a 200 °C downhole environment, which will effectively protect the downhole electronics.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.applthermaleng.2017.01.118Additional details
Identifiers
- DOI
- 10.1016/j.applthermaleng.2017.01.118;
- PII
- S1359-4311(16)32418-8;
Publishing Information
- Journal Title
- Applied Thermal Engineering
- Journal Volume
- 118
- Journal Page Range
- p. 593-599
- ISSN
- 1359-4311
- CODEN
- ATENFT
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 48063604
- Subject category
- S42: ENGINEERING;
- Descriptors DEI
- CASKS; COOLING; ELECTRONIC EQUIPMENT; HEAT PIPES; HEAT STORAGE; PETROLEUM INDUSTRY; PHASE CHANGE MATERIALS; POWER INPUT; RELIABILITY; TEMPERATURE RANGE 0400-1000 K; THERMAL INSULATION
- Descriptors DEC
- CONTAINERS; ENERGY STORAGE; EQUIPMENT; INDUSTRY; MATERIALS; STORAGE; TEMPERATURE RANGE
Optional Information
- Copyright
- Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.