Development and characterisation of Be/Glidcop trademark joints obtained by hot isostatic pressing for high temperature working conditions

Beryllium is a suitable candidate for plasma facing components (PFC) such as divertor or first wall in the ITER project. Due to their high thermal conductivity, copper alloys are used as the heat sink material. Consequently, use of beryllium requires that it has to be joined to the Cu heat sink by some method. In this study, the joining of beryllium onto the copper alloy Glidcop trademark is achieved by hot isostatic pressing diffusion bonding (HIPB). This joining technique allows a homogeneous bonding. As direct bonding between Be and Cu alloy induces intermetallics that are deleterious to the joint, an interlayer is placed between the two materials. The interlayer has been chosen regarding the metallurgical structure and the mechanical properties of beryllium relatively to the Glidcop trademark alloy. This paper describes the structure of joints performed with the help of HIPB at temperature higher than 800 C. (orig.)