Published October 13, 2011 | Version v1
Journal article

Thin films of thermoelectric compound Mg2Sn deposited by co-sputtering assisted by multi-dipolar microwave plasma

  • 1. Institut Neel, CNRS, BP 166, F-38042, Grenoble, Cedex 9 (France)
  • 2. Laboratoire de Physique Subatomique et de Cosmologie - CNRS/UJF/Grenoble INP, 53 rue des Martyrs, 38026 Grenoble, Cedex (France)
  • 3. Department of Physics, Perm State University, 614990 Perm (Russian Federation)

Description

Highlights: → Mg2Sn thin films deposited by plasma co-sputtering, on silicon and glass substrates. → Formation of nano-grained polycrystalline films on substrates at room temperature. → Structural properties vary with target biasing and target-substrate distance. → Formation of the hexagonal phase of Mg2Sn in certain deposition conditions. → Power factor ∼5.0 x 10-3 W K-2 m-1 for stoichiometric Mg2Sn films doped with ∼1 at.% Ag. - Abstract: Magnesium stannide (Mg2Sn) thin films doped with Ag intended for thermoelectric applications are deposited on both silicon and glass substrates at room temperature by plasma assisted co-sputtering. Characterization by scanning electron microscopy, energy-dispersive X-ray spectroscopy and X-ray diffraction confirms the formation of fine-grained polycrystalline thin films with thickness of 1-3 μm. Stoichiometry, microstructure and crystal structure of thin films are found to vary with target biasing and the distance from targets to substrate. Measurements of electrical resistivity and Seebeck coefficient at room temperature show the maximum power factor of ∼5.0 x 10-3 W K-2 m-1 for stoichiometric Mg2Sn thin films doped with ∼1 at.% Ag.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jallcom.2011.07.085

Additional details

Identifiers

DOI
10.1016/j.jallcom.2011.07.085;
PII
S0925-8388(11)01581-7;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
509
Journal Issue
41
Journal Page Range
p. 9906-9911
ISSN
0925-8388
CODEN
JALCEU

Optional Information

Copyright
Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.