Some aspects of deposition of conductive, dielectric and protective coatings on insulators with using arc discharge dc and RF bias

Investigation results for technological process of low temperature plasma deposition of functional coverings for dielectric substrate at low temperatures (50...250 °C) are shown. Combined high frequency and arc plasma sources were used to provide high deposition rate and an opportunity to operate with heat sensitive substrate such as plastic, glass etc. Using this method there were obtained: pads on detectors of ionizing radiation, optically transparent protecting coverings for plexiglass, connecting coverings on mica for ultra-frequency emitter.