Helium irradiation induced ultra-high strength nanotwinned Cu with nanovoids
- 1. School of Materials Engineering, Purdue University, West Lafayette, IN, 47907 (United States)
- 2. Nebraska Center for Materials and Nanoscience, University of Nebraska-Lincoln, Lincoln, NE, 68583-0857 (United States)
Description
There are increasing studies that show nanotwinned (NT) metals have enhanced radiation tolerance. However, the mechanical deformability of irradiated nanotwinned metals is a largely under explored subject. Here we investigate the mechanical properties of He ion irradiated nanotwinned Cu with preexisting nanovoids. In comparison with coarse-grained Cu, nanovoid nanotwinned (NV-NT) Cu exhibits prominently improved radiation tolerance. Furthermore, in situ micropillar compression tests show that the irradiated NV-NT Cu has an ultrahigh yield strength of ∼1.6 GPa with significant plasticity. Post radiation analyses show that twin boundaries are decorated with He bubbles and thick stacking faults. These stacking fault modified twin boundaries introduce significant strengthening in NT Cu. This study provides further insight into the design of high-strength, advanced radiation tolerant nanostructured materials.
Additional details
Identifiers
- DOI
- 10.1016/j.actamat.2019.07.003;
- PII
- S1359645419304331;
Publishing Information
- Journal Title
- Acta Materialia
- Journal Volume
- 177
- Journal Page Range
- p. 107-120
- ISSN
- 1359-6454
- CODEN
- ACMAFD
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 55030695
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- HELIUM IONS; METALS; NANOSTRUCTURES; PLASTICITY; RADIATION HARDENING; STACKING FAULTS; TOLERANCE; YIELD STRENGTH
- Descriptors DEC
- CHARGED PARTICLES; CRYSTAL DEFECTS; CRYSTAL STRUCTURE; ELEMENTS; HARDENING; IONS; MECHANICAL PROPERTIES; PHYSICAL RADIATION EFFECTS; RADIATION EFFECTS
Optional Information
- Copyright
- Copyright (c) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.