Published September 15, 2011 | Version v1
Journal article

Microstructure and properties of diffusion bonded Ti-6Al-4V parts using brazing-assisted hot isostatic pressing

  • 1. College of Engineering and Physical Sciences, University of Birmingham, Edgbaston B15 2TT (United Kingdom)
  • 2. Rolls-Royce, Elton Rd, Derby (United Kingdom)

Description

Highlights: → A low cost method of diffusion bonding has been developed for complex-shaped components of Ti6Al4V. → Vacuum brazing has been used to seal the periphery to allow encapsulation-free HIPping. → The tensile properties of the bonds are comparable with those of the bulk material, but the fatigue life was slightly reduced. - Abstract: Ti-6Al-4V couples have been diffusion bonded by hot isostatic pressing (HIPping) after vacuum brazing was used to seal the periphery of the bonding samples so that no encapsulation was required during HIPping. Analytical scanning electron microscopy was used to assess the microstructure of the HIPped interface and tensile and fatigue properties of bonded samples were compared with those of the bulk starting material. The tensile properties of the bonds were shown to be comparable with those of the bulk material, but the fatigue life was slightly downgraded. The fatigue fractures were initiated by inclusions on the bonding interface, caused by contamination before bonding, but the fatigue cracks did not propagate along the bonding interface indicating a strong bond. It is concluded that this technique of vacuum brazing plus HIPping could be used for encapsulation-free HIPping to produce complex-shaped components.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.msea.2011.06.026

Additional details

Identifiers

DOI
10.1016/j.msea.2011.06.026;
PII
S0921-5093(11)00678-2;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
528
Journal Issue
24
Journal Page Range
p. 7388-7394
ISSN
0921-5093
CODEN
MSAPE3

Optional Information

Copyright
Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.