Effect of various seed metals on uniformity of Ag layer formed by atmospheric plasma reduction on polyethylene terephthalate substrate: An application to electromagnetic interference shielding effectiveness

Highlights: • Uniform silver layer successfully fabricated with the aid of dry plasma reduction. • Fabricated films were applied as electromagnetic interference shielding materials. • Surface of silver layer formed more smoothly and uniformly by applying metal seeds. • The findings may be useful for the development of various low-cost metal films. -- Abstract: Dry plasma reduction under atmospheric pressure is a unique approach for stably, continuously, easily, and uniformly fabricating Ag layer on the metal seeds-polyethylene terephthalate (PET) substrate. In this study, effects of particle size, surface uniformity, surface coverage, and film thickness of metal seeds such as Ag, Cu, Fe and Ni on the formation of uniform Ag layer were studied on the basis of their surface free energies and critical radius, which further leads to variations in the sheet resistance levels of the silver layers. The root mean square roughness and sheet resistance of the Ag layer PET substrate were decreased with the deposition of metal seeds. Among the added seed metals, Ni seed has shown best uniformity. Furthermore, the fabricated films were applied for electromagnetic interference (EMI) shielding. Among the added seed metals, Ni has shown the highest electromagnetic interference shielding effectiveness. The present study will be useful for the development of various low-cost metal films in the field of EMI shielding.