Published August 28, 1984 | Version v1
Patent Metadata-only

Electrochemical treatment of copper for improving its bond strength

Creators

Description

A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an elelectrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil

Availability note (English)

U.S. Commissioner of Patents, Washington, D.C. 20231, USA, $.50.

Additional details

Publishing Information

Imprint Pagination
v p.
IPC:
Int. Cl. C25D 5/10.
IPC
Int. Cl. C25D 5/10.
Patent number
US patent document 4,468,293/A/

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
16049292
Subject category
S37: INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY; S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Non-conventional Literature
Descriptors DEI
BINDING ENERGY; CHEMICAL BONDS; CHEMICAL REACTIONS; COPPER; ELECTROCHEMISTRY; ELECTROLYTIC CELLS; FOILS; OPTIMIZATION
Descriptors DEC
ELEMENTS; ENERGY; METALS; TRANSITION ELEMENTS

Optional Information

Notes
PAT-APPL-460630.