Published February 28, 2019 | Version v1
Journal article

Effect of Sn contents on thermodynamic, microstructure and mechanical properties in the Zn90–Bi10 and Bi88–Zn12 based ternary alloys

  • 1. Erciyes University, Institute of Natural and Applied Sciences (Turkey)
  • 2. Abdullah Gül University, Department of Materials Science and Nanotechnology (Turkey)
  • 3. Erciyes University, Department of Physics, Faculty of Science (Turkey)
  • 4. Kocaeli University, Department of Physics (Turkey)
  • 5. Yıldız Technical University, Department of Metallurgical and Materials Engineering (Turkey)
  • 6. Nevşehir Hacı Bektaş Veli University, Department of Physics (Turkey)

Description

The thermal conductivity variations with temperature for Zn90 − x–Snx–Bi10 (x = 5,10, 40 and 85 wt%) and Bi88 − x–Snx–Zn12 (x = 1.39, 43.26 and 79.3 wt%) alloys were measured by using the linear heat flow method. From thermal conductivity–temperature plots, the coefficients of thermal conductivity for the Zn–Sn–Bi alloys were calculated. The microstructures of Zn–Sn–Bi alloys were observed using scanning electron microscopy (SEM). The existing phases into microstructure were identified energy dispersive X-ray (EDX) analysis. The melting temperatures, the enthalpy of fusion and specific heat change between the liquid and solid phases in the Zn–Sn–Bi alloys were determined from Differential Scanning Calorimetry (DSC) trace. The tensile strength and microhardness of the alloys were measured using a Shimadzu Universal Testing Instrument (Type AG-10 KNG) and Future-Tech FM-700 model microhardness device.

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Identifiers

Publishing Information

Journal Title
Journal of Materials Science. Materials in Electronics
Journal Volume
30
Journal Issue
4
Journal Page Range
p. 3678-3691
ISSN
0957-4522
CODEN
JSMEEV

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Copyright
Copyright (c) 2019 Springer Science+Business Media, LLC, part of Springer Nature