Development of thickness measurement and thickness trend monitoring technology using high-temperature thin-film UT sensor

In order to solve the problems of the thickness measurement, we have developed a thin-film UT sensor having excellent high-temperature durability and conformability in thin film form. In this paper, it was confirmed that the accuracy of thickness measurement for both complex geometries and plates at high-temperature was equivalent to the accuracy of conventional thickness measurement methods. It was also confirmed that the durability at high temperature and for temperature change in the actual equipment was sufficient by continuous heating and cycle heating tests. In addition, it was confirmed that continuous use for long term was possible by lifetime assessment. It is expected that through making the test results publicly known and a field trial in the actual plant, we are aiming to take this technique in to the Japanese standard for periodic inspection in the next step. (author)