Published October 1, 2012 | Version v1
Journal article

Deformation behaviour of polysilicon components for MEMS

  • 1. Department of Materials Science and Engineering, The University of Sheffield, Sheffield, S1 3JD (United Kingdom)
  • 2. QinetiQ, St. Andrews Road, Malvern, Worcestershire, WR14 3PS (United Kingdom)

Description

The mechanical performance of miniaturized Si components depends on both microstructure and geometry. Nanoscale polysilicon beams with both fixed–fixed and portal–frame-type beam geometries have been experimentally deformed and modelled using FEA. It is shown here that the combination of both geometry of a beam support and nanoscale dimensions results in a significantly different mechanical response of beams to that predicted using bulk properties. In a fixed–fixed configuration, beams exhibit limited elasticity followed by rapid failure occurring at the beam mid-point. However, by allowing the beam to have a less rigid connection to the substrate as in the case for a portal–frame geometry, a beam of similar dimensions can undergo significantly more deformation (∼five times more), without failure. The increased flexibility of the support connection results in lower stresses particularly at critical positions along the beam and a lower maximum tensile stress of ∼35–40% less than for a fixed–fixed beam geometry. We also show that for cyclic deformation, a build-up in residual beam deformation is related to changes in microstructure, which can relax back to a less deformed state without continuously applied high deformation levels. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0960-1317/22/10/105016

Additional details

Publishing Information

Journal Title
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Journal Volume
22
Journal Issue
10
Journal Page Range
[8 p.]
ISSN
0960-1317
CODEN
JMMIEZ

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47010038
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
BEAMS; DEFORMATION; ELASTICITY; FAILURES; FLEXIBILITY; GEOMETRY; MEMS; MICROSTRUCTURE; NANOSTRUCTURES; SILICON; STRESSES; SUBSTRATES
Descriptors DEC
ELEMENTS; MATHEMATICS; MECHANICAL PROPERTIES; SEMIMETALS; TENSILE PROPERTIES