The titanium deposition process

the deposition of titanium layers using hot cathode ion plating has been investigated. The apparatus used and the method itself have been described elsewhere. This apparatus has been used earlier for chromium deposition. The process parameters have been suitably changed for titanium plating. It has been found that the titanium deposition process is more sensitive to deposition condition changes than other materials thus the discharge parameters /electrical voltages and working gas pressure should be kept in the relatively narrow range. The plasma source current-voltage characteristics and electrical characteristics of the titanium plating process have been measured and compared with those of chromium and copper. (author)