Study and construction of a high frequency power preamplifier applying thick film hybrid technology
Description
Two hybrid circuit manufacturing techniques are compared. The circuits are used in high frequency range devices. One circuit is manufactured on a copper coated epoxy substrate, using classical printed circuit method. The second circuit is fabricated on ceramic (aluminia 96%) substrate, by means of the serigraphy of conducting paths and resistances. Among the advantages of the thick film hybrid technology, the power dissipation factor, the conductor adherence and the minimization of undesirable effects, may be pointed out. The metal coatings are resistant to the dissolving phenomenum caused by the tin-lead-silver welding process. The described circuits are light and the few number of welded joints allow the obtention of high strength, high reliability and low maintainance cost systems
Availability note (English)
MF available from INIS under the Report Number.Abstract (French)
L'etude porte sur la comparaison de deux techniques de realisation de circuit hybride, utilisees dans le domaine des hautes frequences. Une premiere realisation est faite sur un support d'epoxy metallise sur les deux faces avec du cuivre et prepare selon la technique classique du circuit imprime. La deuxieme realisation est faite sur un substrat ceramique (alumine 96%) par serigraphie des pistes conductrices et des resistances. Parmi les avantages favorables au choix de la technologie hybride couche epaisse, la puissance a dissiper, l'adherence des conducteurs et la minimisation des elements parasites, peuvent etre citees. De plus les metallisations resistent bien au phenomene de dissolution provoque par la soudure etain-plomb-argent. Enfin la legerete des composants rapportes, la reduction du nombre de soudures donnent une grande robustesse aux circuits augmentant la fiabilite et reduisant notablement le cout d'entretienFiles
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Additional details
Additional titles
- Original title (French)
- Etude et realisation d'un preamplificateur rapide de tension en technologie hybride couche epaisse
Publishing Information
- Imprint Pagination
- 128 p.
- Report number
- CRN-CPR--89-04
INIS
- Country of Publication
- France
- Country of Input or Organization
- France
- INIS RN
- 21080383
- Subject category
- S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
- Resource subtype / Literary indicator
- Thesis
- Descriptors DEI
- ALUMINIUM OXIDES; COATINGS; COPPER; DISSIPATION FACTOR; FABRICATION; FILMS; HIGH FREQUENCY AMPLIFIERS; POWER AMPLIFIERS; PREAMPLIFIERS; PRINTED CIRCUITS; RELIABILITY; SUBSTRATES; SURFACE COATING
- Descriptors DEC
- ALUMINIUM COMPOUNDS; AMPLIFIERS; CHALCOGENIDES; DEPOSITION; ELECTRONIC CIRCUITS; ELECTRONIC EQUIPMENT; ELEMENTS; EQUIPMENT; METALS; OXIDES; OXYGEN COMPOUNDS; TRANSITION ELEMENTS