Published 2001
| Version v1
Miscellaneous
High temperature structure and properties of grain boundaries - insights obtained from atomic level simulations
Creators
- 1. Materials Science and Engineering Department, Rensselear Polytechnic Institute, Troy (United States)
Description
no abstract available
Additional details
Publishing Information
- Imprint Title
- Abstracts of 4. International School and Symposium on Physics in Materials Science ISSPMS'2001
- Imprint Pagination
- [52 p.]
- Journal Page Range
- p. 11
Conference
- Title
- 4. International School and Symposium on Physics in Materials Science ISSPMS'2001
- Dates
- 23-29 Sep 2001
- Place
- Jaszowiec (Poland)
INIS
- Country of Publication
- Poland
- Country of Input or Organization
- Poland
- INIS RN
- 33063312
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- No Abstract, Conference, Non-conventional Literature
- Descriptors DEI
- ACTIVATION ENERGY; CREEP; DIAMONDS; DIFFUSION; GRAIN BOUNDARIES; GRAIN SIZE; METALS; MICROSTRUCTURE; MOBILITY; MOLECULAR DYNAMICS METHOD; POLYCRYSTALS; SILICON; SIMULATION; STRESSES; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE 0400-1000 K; TENSILE PROPERTIES
- Descriptors DEC
- CALCULATION METHODS; CARBON; CRYSTALS; ELEMENTS; ENERGY; MECHANICAL PROPERTIES; MICROSTRUCTURE; MINERALS; NONMETALS; SEMIMETALS; SIZE; TEMPERATURE RANGE