Published January 20, 2006
| Version v1
Journal article
A model for copper deposition in the damascene process
- 1. UPR 15 CNRS, LISE, University P. et M. Curie, 75252, Paris (France)
- 2. Air Liquide, Centre de Recherche Claude Delorme, 78354 Jouy en Josas (France)
- 3. Chicago Research Center, Countryside, IL 60525 (United States)
Description
Copper deposition in a plating bath known to fill narrow trenches was studied on a rotating disc electrode by impedance measurements. The chemistry of this bath contained, in addition to sulphuric acid, copper sulphate and chloride ions, polyethylene glycol (PEG) as an inhibitor and 3-mercapto-1-propanesulfonate, sodium salt (MPSA) as an accelerator. The experimental results were compared with a model taking into account these organic additives. A competitive adsorption of two complexes: PEG-Cl-CuI and CuISPS formed from Cu+ and the additives, is proposed. A good agreement was shown between this model and the experiments on fresh plating bathes
Additional details
Identifiers
- DOI
- 10.1016/j.electacta.2005.02.127;
- PII
- S0013-4686(05)00826-1;
Publishing Information
- Journal Title
- Electrochimica Acta
- Journal Volume
- 51
- Journal Issue
- 8-9
- Journal Page Range
- p. 1462-1472
- ISSN
- 0013-4686
- CODEN
- ELCAAV
Conference
- Title
- 6. international symposium on electrochemical impedance spectroscopy
- Acronym
- EIS 2004
- Dates
- 16-21 May 2004
- Place
- Cocoa Beach, FL (United States)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 38016407
- Subject category
- S37: INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ADDITIVES; ADSORPTION; CHLORINE IONS; COPPER; COPPER IONS; ELECTROCHEMISTRY; ELECTRODES; ELECTROPLATING; IMPEDANCE; POLYETHYLENE GLYCOLS; SODIUM COMPOUNDS; SULFATES; SULFURIC ACID
- Descriptors DEC
- ALCOHOLS; ALKALI METAL COMPOUNDS; CHARGED PARTICLES; CHEMISTRY; DEPOSITION; ELECTRODEPOSITION; ELECTROLYSIS; ELEMENTS; GLYCOLS; HYDROGEN COMPOUNDS; HYDROXY COMPOUNDS; INORGANIC ACIDS; INORGANIC COMPOUNDS; IONS; LYSIS; METALS; ORGANIC COMPOUNDS; ORGANIC POLYMERS; OXYGEN COMPOUNDS; PLATING; POLYMERS; SORPTION; SULFUR COMPOUNDS; SURFACE COATING; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.