Published December 1, 2010 | Version v1
Journal article

Integrity of functional self-assembled monolayers on hydrogen-terminated silicon-on-insulator wafers

  • 1. Department of Chemistry and Biochemistry, University of Delaware, Newark, DE 19716 (United States)
  • 2. Department of Materials Science and Engineering, University of Delaware, Newark, DE 19716 (United States)

Description

Silicon-on-insulator (SOI) wafers are commonly used to design microelectronics, energy conversion, and sensing devices. Thin solid films on the surfaces of SOI wafers have been a subject of numerous studies. However, SOI wafers modified by self-assembled monolayers (SAMs) that can also be used as functional device platforms have been investigated to a much lesser extent. In the present work, tert-butoxycarbonyl (t-boc, (CH3)3-C-O-C(=O)-)-protected 1-amino-10-undecene monolayers were covalently attached to a H-terminated SOI (1 0 0) surface. The modified wafers were characterized by X-ray photoelectron spectroscopy to confirm the stability of the SAM/Si interface and the integrity of the secondary amine in the SAM. The transmission electron microscopy investigation suggested that this t-boc-protected 1-amino-10-undecene SAM produces atomically flat interface with the 2 μm single crystalline silicon of the SOI wafer, that the SiOx and both available Si/SiOx interfaces are preserved, and that the organic monolayers are stable, with apparent thickness of 1.7 nm, which is consistent with the result of the density functional theory modeling of the molecular features within a SAM.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2010.08.058

Additional details

Identifiers

DOI
10.1016/j.apsusc.2010.08.058;
PII
S0169-4332(10)01136-0;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
257
Journal Issue
4
Journal Page Range
p. 1314-1318
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.